Thin Section Cutting and Grinding Machine: CLG50 Now Available!
1. Capable of preparing thin sections as thin as 40 μm, meeting high-precision preparation requirements
2. Cutting and grinding accuracy within ±10 μm ensures stable and reliable results
3. Transverse resolution of 1 μm enables more precise sample positioning
4. Allows direct grinding after cutting, saving time and improving efficiency
5. Equipped with a vacuum clamping system for secure sample fixation
6. Filtration system with automatic drainage for easier maintenance and operation
📩 Contact us now for a product quote!
